West Lafayette, IN (November 5, 2019) – Parsolex and Bosch Packaging Technology (“Bosch”) are pleased to announce a strategic partnership, granting Parsolex access to the latest Bosch pharmaceutical ...

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

Imagine a line of garbage trucks, filled to capacity with discarded plastic packaging, stretching bumper-to-bumper across three lanes of traffic all the way down I-95 from Boston to Miami. Then dump ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

ELIS Manufacturing and Packaging Solutions Inc. announced continued investment in and refinement of its stick pack manufacturing and packaging capabilities, reinforcing the company’s role in ...

Mondelez International has been granted a patent for a method of manufacturing comestibles. The process involves shaping a comestible mass into a desired structure using a forming station and then ...

According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South ...

Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) reported Q1 CY2026 results , with sales up 11.5% ...