On May 25, He Tingbo, president of Huawei’s semiconductor business department, published a paper on ChinaXiv detailing the newly proposed “Tau (τ) Scaling Law” and parts of the roadmap for Huawei’s Kirin and Ascend chips. “Keep moving forward, a bridge and way will emerge,” He Tingbo recently spoke with the People's Daily about Huawei’s chip progress and its new semiconductor design approach.

HUAWEI's He Tingbo presents a sustainable evolutionary path for semiconductors enabled by shifting from geometric to time scaling, delivering benefits across the industry as a whole.

It's been a long journey — 6 years and 381 chips to be exact — but HUAWEI's He Tingbo explains how HUAWEI's high-end chips are now expected to feature a transistor density that is equivalent to 14 Å (1.4 nm) processes by 2031.